Chemical Vapor Depositon (CVD)

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2/2/2016

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Chemical Vapor Deposition (CVD)

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7/30/2015 through  2/20/2015

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1. Introduction

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1 Introduction

1. “Chemical vapor deposition (CVD) is a chemical process used to produce high-purity, high-performance solid materials. The process is often used in the semiconductor industry to produce thin films. In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Microfabrication processes widely use CVD to deposit materials in various forms, including: monocrystalline, polycrystalline, amorphous, and epitaxial. These materials include: silicon, carbon fiber, carbon nanofibers, filaments, carbon nanotubes, SiO2, silicon-germanium, tungsten, silicon carbide, silicon nitride, silicon oxynitride, titanium nitride, and various high-k dielectrics. The CVD process is also used to produce synthetic diamonds.”

(Chemical Vapor Deposition, Wikipedia, 2/20/2013)

 

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Roger D. Corneliussen
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www.maropolymeronline.com

Maro Publications
E-Mail: cornelrd@bee.net  

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Copyright 2015 by Roger D. Corneliussen.
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